Collaboration with Infineon on Optimized DC Link Design for the New HP Drive 6 Pack IGBT Module

Infineon HP - vertical integration

Vertical Integration

SBE is designing a fully size-and-performance compatible DC Link system for the HP Drive IGBT module in collaboration with Infineon. Both vertical and horizontal connection systems will be available. The vertical system is designed to occupy the same footprint as the HP Drive itself and the horizontal system will respect the shorter length of the new HP Drive. This way, customers will be able to take full advantage of the size reduction offered by the improved Infineon technology and trust in the demonstrated performance and lifetime capability of the SBE Power Ring Film Capacitor technology.

The SBE DC Link system is fully capable of supporting the voltage and current options that can be used with the new Infineon HP Drive module. Yet the size is greatly reduced from conventional DC Link systems used today with the larger HP2 module systems. The SBE system insures that the customer can actually realize the potential inverter power density improvement which can be facilitated by the Infineon HP Drive.

Vertical Configuration

Vertical Configuration

SBE is known in the industry as providing the highest ripple current density available. There is no need to sacrifice the capability of this exciting product development by Infineon by using standard technology offerings for the required DC Link system.

SBE will have sample systems available at the time of release of the Infineon HP Drive and prototype and preproduction systems over the coming months. Starting in 1Q15, you will be able to order these products on the SBE on line store. However, as we expect demand for these initial prototypes to be high, you are welcome to pre-order by contacting customer service at [email protected].

Horizontal Configuration

Horizontal Configuration

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